pure green led chip gap/gap 1. material substrate gap (n type) epitaxial layer gap (p/n type) 2. electrode n(cathode) side gold alloy p(anode) side gold alloy 3. electro-optical parameter s ymbo l min typ max unit condition characteristics v f(1) 1.8 v if=1ma v f(2) 2.3 2.5 v if=20ma reverse voltag e v r 6 v ir=10ua brightness iv 200 250 mcd if=20ma d 564 nm if=20ma ? 24 nm if=20ma note : brightness is measured by sorter e/t system with bare chip. 4. mechanical data (a) emission area -------------------- - 10mil x 10mil (b) bottom area -------------------- - 11mil x 11mil (c) bonding pad -------------------- - 115um (d) chip thickness -------------------- - 11mil (e) junction height -------------------- - 10.5mil epi epi p n p side electrode n side electrode eoyang factory,513-5 eoyang-dong, iksan, 570-210, korea tel. +82 63 839 1111 fax. +82 63 835 8259 www.auk.co.kr OPA5536 forward voltag e wavelength auk corp. (c) (a) (b) (e) (d) substrate
|
